1、招标条件
项目概况:完成超纯水及回收系统的深化设计;提供达成超纯水及回收系统功能之一切设备、材料、人工、机具等(包含本设备的动力设施衔接);负责整个超纯水及回收系统工程的安全、质量、进度管理等。
资金到位或资金来源落实情况:现招标人资金已到位,具备了招标条件。
项目已具备招标条件的说明:现招标人资金已到位,具备了招标条件。
2、招标内容
招标项目编号:0613-234022080503
招标项目名称:超纯水及回收系统
项目实施地点:上海市
招标产品列表(主要设备):
序号 | 产品名称 | 数量 | 简要技术规格 | 备注 |
1 | 超纯水及回收系统 | 1 | 完成超纯水及回收系统的深化设计;提供达成超纯水及回收系统功能之一切设备、材料、人工、机具等(包含本设备的动力设施衔接);负责整个超纯水及回收系统工程的安全、质量、进度管理等。 |
3、投标人资格要求
投标人应具备的资格或业绩:3、*投标人资格要求/Qualification Requirements For Bidder:
(1)投标人必须在上海地区或周围有完善的售后服务机构,有集中的备品供应中心,系统发生重大异常时,服务人员到现场时间不得超过4小时。
The bidder must hA/Ve a perfect after-sales service organization and a centralized spare parts supply center in or around Shanghai. In the event of a major anomaly in the system, the service personnel shall not arrive at the site for more than 4 hours
(2)投标人近三年无重大质量和安全事故发生,在同类项目中无不良记录。
The bidder has no major quality and safety accidents in the past three years, and no bad record in similar projects
(3)投标人需对本项目的设计、设备、安装、项目进度 、质量及安全等方面负责。如需要分包,须在投标文件中 提供分包方案,但该分包方案并不能减免投标人的相关责任。
The bidder shall be responsible for the design, equipment, installation, project schedule, quality and safety of the project. If subcontracting is required, the subcontracting scheme shall be provided in the bidding documents, but the subcontracting scheme does not relieve the bidder of the relevant responsibilities
(4)投标人需提供2021.1~2023.1期间2个及以上的半导体领域12寸集成电路制造纯水项目业绩,且要求项目已经顺利生产。
The Bidder shall provide the performance of 2 or more 12-inch wafers manufacturing pure water projects in the semiconductor field during the period from 2021.1 to 2023.1, and the project is required to hA/Ve been successfully produced
(5)投标人或者投标联合体中负责施工的一方必须具备不低于机电安装工程专业承包一级或机电工程施工总承包一级的资质。
The bidder must hA/Ve the qualification not lower than the professional contracting level of mechanical and electrical installation engineering or the general contracting level of mechanical and electrical engineering construction
(6)项目经理需具有2个及以上12寸集成电路制造纯水项目施工管理经验;系统调试负责人需具有2个及以上12寸集成电路纯水项目的成功调试经验;设计负责人需具有2个及以上12寸集成电路制造纯水项目设计经验。(需提供承诺函)
The project manager must hA/Ve 2 or more 12-inch integrated circuit manufacturing pure water project construction management experience; the system debugging person in charge must hA/Ve 2 or more 12-inch integrated circuit pure water project successful debugging experience; the design leader must hA/Ve 2 or more 12-inch integrated circuit manufacturing pure water project design experience(A letter of commitment is required)
(7)投标人采用联合体的方式,主投标人资质需满足上述对投标人的要求。须在投标文件中提供联合投标的方案,但该方案并不能减免主投标人的相关责任。
The bidder shall adopt the method of consortium, and the qualification of the lead bidder shall meet the above requirements for the bidder. The joint bidding scheme shall be provided in the bidding documents, but the scheme does not relieve the main bidder of the relevant responsibilities
(8)联合投标要求主投标人提供工艺设计、平面布置、管道装配及电气设计等相关的全套图纸,负责系统工艺调试 ,并对调试结果负责。
Joint bidding requires the main bidder to provide a full set of drawings related to process design, plane layout, pipeline assembly and electrical design, responsible for the system process debugging, and responsible for the debugging results
(9)法律、行政法规规定的其他条件。
Other conditions as prescribed by laws and administrative regulations.
4、本次招标接受联合体投标。/Joint Bids is A/Vailable.
(1)本项目允许联合投标,如果是联合体投标,则联合体各方必须按招标文件提供的格式签订联合体协议书,明确联合体牵头人和各方的权利义务;联合体成员不超过三家;联合体牵头人必须是二次深化设计的负责方。
The consortium bid is accepted in the tender. If the bidder forms a ConSORTIUM to make a joint bidding for the project, all members of the ConSORTIUM shall sign a consortium agreement according to the format in the bidding document. The consortium agreement shall definite the responsibility, right and obligation among the leading party and other members of the tender. The ConSORTIUM is no more than three union members. The consortium leader must be the responsible party of the secondary deepening design.
(2)联合体各方不得再以自己名义单独或加入其他联合体参与投标。
Each member shall not make a bid in this project in one’s own name or as a member of other consortium.
是否接受联合体投标:接受
未领购招标文件是否可以参加投标:不可以
4、招标文件的获取
招标文件领购开始时间:2023-02-18
招标文件领购结束时间:2023-02-24
是否在线售卖标书:否
7、联系方式
招标人:上海积塔半导体
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